Cal Poly will host the 2017 Poly Pack Symposium on Thursday, February 9 in the Advanced Technology Laboratories (building No.7) beginning at 8:30 a.m. The event, put on by the student club Poly Pack, will give packaging professionals, academics and students the chance to discuss industry trends, learn new techniques, and network on campus.
“Packaging the Future” is this year’s theme. The event will feature presentations from packaging leaders at corporations around the nation, including DOW Chemical Company, Amazon, Lansmont and Fitbit. Attendees will explore topics like sustainability, supply chain efficiency, technology packaging in e-commerce, and materials innovations. The event concludes with a tour of Cal Poly’s packaging labs with the program’s faculty.
The event is intended for packaging industry professionals, including development engineers, marketing managers, materials experts, machinery solution providers, and industry consultants.
After the symposium, Poly Pack will host the Egg Drop competition at the San Luis Obispo Farmers’ Market beginning at 6 p.m. The Cal Poly Packaging Program booth will be located at the corner of Higuera and Garden streets. Participants can construct protective packaging for an egg, which will be dropped from a height of 30 feet. Awards will be given for best improvised packaging, best pre-made kit construction, and top professional product submission. Eggs will be provided; participants may not bring their own eggs.
Registration for the symposium is $250 per person. Student admission is free. Participants can also register for a celebratory banquet and silent auction at Café Roma in San Luis Obispo at 8 p.m. For more information and registration, visit https://www.cob.calpoly.edu/polypack/poly-pack-symposium/.