Jay Singh

Jay received his MS and PhD in Packaging Science from Michigan State University. Considered amongst the top experts in the field of distribution packaging globally, Jay has published over 90 peer-reviewed articles, 65 articles in conference proceedings, 27 trade journal articles, 3 book chapters, coauthored 2 books and edited 1 book. With citation indices at 20 (h-index) and 31 (i10-index), his readership for Digital Commons currently stands at 146,042 downloads from 8,902 institutions in 189 countries. A number of his publications have resulted in development/modification of numerous globally acknowledged packaging test standards. Several of his research efforts have led to innovative packaging designs that have since been implemented in the field. His expertise includes teaching, training, testing services and contract research in package design, distribution environment measurement and simulation, material and package testing, package design, product-package compatibility and life cycle assessment (LCA). His research streams of packaging dynamics and packaging value chain have progressively developed a focus on efficient/sustainable packaging solutions and reducing food loss. Jay currently serves as the President of International Association of Packaging Research Institutes (IAPRI) and on the Global Board of Directors for the International Safe Transit Association (ISTA). He has undertaken numerous funded grants from state and federal agencies as well as from the industry.

Education

• Ph.D. Michigan State University, East Lansing, MI. Packaging Science, 2002
• M.S. Michigan State University, East Lansing, MI. Packaging Science, 1998
• B.S. Pune University, Pune, India. Electrical Engineering, 1992.

Experience

• Director of Packaging Program – Orfalea College of Business, Cal Poly, 2003-present
• Distinguished Scholar – Cal Poly, 2017
• President – International Association of Packaging Research Institutes, 2016-present
• Global Board of Directors – International Safe Transit Association, 2012-present

US Patents

• US 2011/0315752 A1,
• US 2012/0028531 A1,
• US 2013/0057268 A1 & US20140272412 A1